Method for forming solder bumps
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United States of America Patent
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Nov 20, 2001
Issued Date -
N/A
app pub date -
Jun 6, 1996
filing date -
Jan 20, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Method for forming solder bumps on a first member such as a semiconductor chip having electrode pads formed thereon. A flat plate having holes is prepared and the holes are filled with solder paste by squeezing. The flat plate is then overlapped with the first member with the flat plate above the first plate. The flat plate and the first member are heated to a temperature higher than the melting point of the solder alloy in the solder paste. Therefore, solder bumps having identical sizes and uniform structures can be obtained.
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