Coating film forming method and coating apparatus
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United States of America Patent
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-
Nov 20, 2001
Grant Date -
N/A
app pub date -
Apr 18, 2000
filing date -
Apr 19, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
A spreading state of an outline of the outer periphery of a coating solution is detected by a detecting sensor, and the rotation speed or the like of a wafer as a substrate is controlled so that a spreading speed of the outline becomes not more than a predetermined speed with no danger of producing a scratchpad. Alternatively, the width in the radius direction of a scratchpad is measured, and the rotation speed or the like of the wafer is controlled so that the width in the radius direction becomes not more than a predetermined value. Thereby, occurrence of the scratchpad is prevented or the degree thereof is decreased, thereby avoiding uncoating of the coating solution on the substrate and reducing the amount of the coating solution used.
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