Printed circuit boards as insulated components for a time of flight mass spectrometer
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United States of America Patent
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Nov 13, 2001
Grant Date -
N/A
app pub date -
Mar 14, 1997
filing date -
Mar 14, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention is embodied in a method and apparatus for utilizing inherently insulative material, such as the glass and epoxy resins used in construction of printed circuit boards, for construction of components in a time of flight mass spectrometer. By using printed circuit board materials, the present invention can take advantage of fabrication techniques for providing circuit traces on surfaces, from one side to another as a via, or embedded within the printed circuit material so as to be covered except where necessary to be exposed to make contact with other electrical devices. Embedded circuit traces also enable capacitive coupling to AC energy while maintaining electrical and physical isolation. Consequently, the present invention enables both invasive and non-invasive access to pressure and vacuum chambers.
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