Apparatus for the thermal treatment of substrates
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United States of America Patent
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-
Nov 13, 2001
Grant Date -
N/A
app pub date -
Oct 6, 2000
filing date -
Mar 2, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus for the thermal treatment of substrates is provided. The apparatus includes a reaction chamber, at least one elongated heat source, and at least one reflection wall that is disposed adjacent to the heat source and serves to reflect at least a portion of the radiation given off thereby. The reflection wall has at least one rib, and the heat source is disposed at an oblique angle to the longitudinal direction of the rib.
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