Wire enamels containing polyesterimides and/or polyamideimides with polyoxyalkylenediamines as molecular elements
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United States of America Patent
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Nov 13, 2001
Grant Date -
N/A
app pub date -
Mar 30, 1999
filing date -
Aug 9, 1996
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Expired
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Abstract
The invention relates to wire enamels comprising as binders polyesterimide and/or polyamideimide, the binders comprising as monomeric building blocks polyoxyalkylenediamine having terminal amino groups. The polyoxyalkylenediamines are preferably selected from the group polyoxyethylenediamine, polyoxypropylenediamine and polyoxyethylenepropylenediamine. The invention also encompasses the use of the novel wire enamels for coating copper wires, especially thick round wires or profiled wires.
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