Semiconductor device
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United States of America Patent
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Nov 6, 2001
Grant Date -
N/A
app pub date -
Nov 2, 1998
filing date -
Jun 28, 1996
priority date (Note) -
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Abstract
A semiconductor component is fashioned of a chip carrier comprising an approximately planar chip carrier surface on which chip carrier surface a semiconductor chip with a pressure sensor is secured, and composed of electrode terminals penetrating the chip carrier and electrically connected to the semiconductor chip, with a surface-mounted arrangement. The chip overlapping the chip carrier.
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