Via fill formulations which are electrically and/or thermally conductive, or non-conductive
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United States of America Patent
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Nov 6, 2001
Grant Date -
N/A
app pub date -
Nov 12, 1999
filing date -
Nov 17, 1998
priority date (Note) -
Expired
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Abstract
A via fill formulation including electrically and/or thermally conductive particulate filler, or non-conductive, electrically conductive polymer and a resin vehicle.
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