Method of manufacturing solder balls

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6312498
SERIAL NO

09460573

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Method for manufacturing solder balls is disclosed. The apparatus comprises a tundish, a vibrator, a cooling liquid tank, an inactive atmospheric chamber, a molten metal receiving tray, a ball collecting barrel and a cooling liquid reservoir. The tundish has orifices at its bottom. The vibrator is immersed in the molten metal of the tundish and generates vibrations. The cooling liquid tank is situated under the tundish and is provided with a cooling liquid heater at its upper and middle outer surface and a cooling liquid cooler at its lower outer surface. The inactive atmospheric chamber is interposed between the bottom of the tundish and the top surface of the cooling liquid. The molten metal receiving tray is seated on a portion of the inactive atmospheric chamber and is horizontally movable. The ball collecting barrel is positioned under the cooling liquid tank and is provided with a cut-off valve at its top, a ball removing valve at its bottom and a cooling liquid supply conduit at its upper portion.

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Patent Owner(s)

Patent OwnerAddress
MK ELECTRON CO LTD316-2 GEUMUH-RI POGOK-MYUN YONGIN-CITY KYUNGKI-DO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Jin Kyongki-do, KR 168 2909
Lee, Jin-Hyung Daejeonkwangyuk-shi, KR 66 337
Moon, Byung Chul Seoul-si, KR 5 12
Moon, Jeong-Tak Kyongki-do, KR 3 13
Nam, Jae Gyu Kyongki-do, KR 2 11
Oh, Chang-Rok Kyongki-do, KR 2 11

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