Developing apparatus and method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 6, 2001
Grant Date -
N/A
app pub date -
Aug 9, 2000
filing date -
Aug 12, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A current member is disposed above a wafer holding section for holding a wafer and a top plate and a bottom plate of the current member are positioned so that respective air holes are overlapped each other in a vertical direction, and a developing solution is heaped on a front face of the wafer. Thereafter, the developing is performed with the bottom plate of the current member slid in a lateral direction so that the air holes are not overlapped each other in the vertical direction. In this configuration, air streams to the wafer are obstructed during the developing because the air holes in the current member are obstructed in the vertical direction, whereby occurrence of temperature distribution of the developing solution within the plane of the wafer caused by flows of air currents to the wafer is prevented and uniform developing processing can be performed.
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