Method of interconnecting a printhead with an ink supply manifold and a combined structure resulting therefrom

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United States of America Patent

PATENT NO 6312114
SERIAL NO

09425421

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Abstract

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A method of interconnecting a pagewidth printhead containing an array of ink ejection nozzles to an ink distribution manifold, includes attaching the printhead to the ink distribution manifold. This is done by using a resilient adhesive configured to be elastically deformed with any deflections of the ink distribution manifold. The resilient adhesive can include a silicone elastomer. The printhead is in the form of an elongate printhead chip for use in a pagewidth printer and can be attached to the ink supply unit along the sides and along a back surface thereof.

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Patent Owner(s)

Patent OwnerAddress
MEMJET TECHNOLOGY LIMITEDTRINTECH BUILDING SOUTH COUNTY BUSINESS PARK LEOPARDSTOWN DUBLIN D18 H5H9

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Silverbrook, Kia Balmain, AU 5829 91498

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