Thermal interface materials using thermally conductive fiber and polymer matrix materials
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United States of America Patent
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Nov 6, 2001
Grant Date -
N/A
app pub date -
Nov 8, 1999
filing date -
Nov 8, 1999
priority date (Note) -
Expired
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Abstract
Thermal interface materials for use in space applications. The thermal interface materials comprise a plurality of graphitized thermally conductive (carbon based) fibers 6 that are contained, immersed, or embedded, in one or more substantially non-outgassing polymer matrix materials. Both relatively stiff and relatively stiff and compliant polymer matrix materials may be used to secure the thermally conductive fibers. The thermally conductive fibers and non-outgassing polymer matrix material may be additionally cured to improve their conductive properties. The polymer matrix materials contain volatile condensable material of less than 0.1 percent and exhibit a total mass loss of less than 1.0 percent per an ASTM E595 procedure.
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