Surface acoustic wave device

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United States of America Patent

PATENT NO 6310425
SERIAL NO

09533671

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Abstract

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An SAW device including a glass substrate, an LiNbO.sub.3 (LN) substrate, and an electrode. When a pitch of the electrode is .lambda., a thickness of the LN substrate is H, and K equals to 2.pi./.lambda., a product of K and H is at least 1.6 and at most 1.8. Accordingly, a SAW device which can advantageously reduced in size and provided with an enhanced temperature characteristic is obtained while ensuring high K.sup.2.

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Patent Owner(s)

Patent OwnerAddress
TEEMING DATA LLC160 GREENTREE DRIVE SUITE 101 DOVER DE 19904

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tanaka, Naoki Sakai, JP 131 1515

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