Surface acoustic wave device

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United States of America Patent

PATENT NO 6310423
SERIAL NO

09533666

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Abstract

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An SAW device includes a glass substrate, an LiNbO.sub.3 (LN) substrate, and an electrode. When a pitch of the electrode is .lambda., a thickness of the LN substrate is H, and K equals to 2.pi./.lambda., a product of K and H is at least 0.5 and at most 1.0. Accordingly, an SAW device is obtained which is provided with high K.sup.2 and an enhanced temperature characteristic and which can be advantageously reduced in size.

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Patent Owner(s)

Patent OwnerAddress
TEEMING DATA LLC160 GREENTREE DRIVE SUITE 101 DOVER DE 19904

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ogura, Morio Hirakata, JP 13 75
Tanaka, Naoki Sakai, JP 131 1515

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