Semiconductor package
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United States of America Patent
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Oct 30, 2001
Grant Date -
N/A
app pub date -
Apr 24, 1998
filing date -
Apr 28, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of manufacturing a semiconductor package including the steps of adhering inner leads to a semiconductor chip surface via an insulating adhesive, forming an insulating layer on the semiconductor chip and upper surfaces of the inner leads such that bonding pads formed on the semiconductor chip and portions of the inner leads are exposed through an opening, forming a conductive layer in the opening to electrically connect the bonding pads to the inner leads, and forming a semiconductor package by molding the semiconductor chip, the inner leads, the insulating layer, and the conductive layer with a molding material.
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