Induction heating method for manifold in hot runner mold

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6310333
APP PUB NO 20010000402A1
SERIAL NO

09729205

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Abstract

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In an induction heating method for a manifold in a hot runner mold, it is possible to uniformly heat a material over the entire length of a runner. Also, a coil is easily attached to and detached from the manifold. The hot runner mold includes a fixed mold and a movable mold, and a space is provided along a side surface of the manifold on which clamping force applied by the fixed mold and the movable mold does not act. A coil is wound to the side surface along an axial line of a runner of the manifold within the space such that the manifold is induction-heated from the side surface.

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Patent Owner(s)

Patent OwnerAddress
JU-OH INCHIRATSUKA-SHI KANAGAWA 254-0812

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Edagawa, Shinichi Hiratsuka, JP 2 8
Munakata, Tamotsu Fujisawa, JP 15 137
Sekiguchi, Ryoichi Naka-gun, JP 10 98
Shibata, Itsuo Hiratsuka, JP 6 73
Toki, Hitoshi Isehara, JP 37 318

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