Wafer notch polishing machine and method of polishing an orientation notch in a wafer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Oct 23, 2001
Grant Date -
N/A
app pub date -
Aug 3, 2000
filing date -
Aug 3, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The notch polishing machine employs a plurality of polishing tapes which can be sequentially introduced into the notch of a wafer to polish both sides of the notch, i.e. the top and bottom surfaces. Each tape is pulled off a supply reel and passed into a mounting block sized to fit into the wafer notch. Each block is also mounted to be oscillated to effect a polishing action. Also, all the blocks are mounted in common to be pivoted between a position angularly disposed relative to the top of the top of the wafer and a position angularly disposed relative to the bottom of the wafer.
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