Clip for securing heat sink to electronic device package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Oct 16, 2001
Grant Date -
N/A
app pub date -
Sep 25, 2000
filing date -
May 25, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A clip includes a pin (40) and a leaf spring (50). The pin includes a columnar body (44), an expanded head (42) formed at a top end of the body, and a cone-shaped plug (48) formed at a bottom end of the body opposite the head. A slot (488) is defined through the plug and a bottom portion of the body, to enable the plug to elastically deform. The plug is thus adapted for extending through a heat sink and engaging with a printed circuit board. A flange (46) extends perpendicularly from the body between the head and the plug. The leaf spring includes a base (51), with an opening (52) defined therein for extension of the pin therethrough. A pair of inflexed prolongations (53) extends progressively downwards from opposite corners of the base, with the width of each prolongation being less than half the width of the base.
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