Compositions for and method of reducing/eliminating scratches and defects in silicon dioxide during CMP process
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United States of America Patent
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Oct 16, 2001
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app pub date -
Sep 30, 1999
filing date -
Sep 30, 1999
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Abstract
An aqueous slurry-less composition for chemical-mechanical-polishing of a silicon dioxide workpiece comprising: a cationic surfactant that is soluble and ionized at neutral to alkaline pH conditions, in which the cationic surfactant is present in an aqueous slurry-less composition in an amount less than its critical micelle concentration.
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