Apparatus for testing the integrity of a bond
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United States of America Patent
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Oct 16, 2001
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N/A
app pub date -
Nov 20, 1998
filing date -
Nov 20, 1997
priority date (Note) -
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Abstract
Apparatus for testing electrical wire bonds of semiconductor devices includes two unequal length cantilever arms (14a, 14b) on a baseplate (11) and a test head (15) at the free end of the arms. The arrangement ensures substantially frictionless straight line movement of a test hook (32) on the text head over the range of deflection expected. A pneumatic or magnetic (21, 22) frictionaless damper is disclosed. The test hook (32) may be orientated by a stepper motor (35) of the test head.
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