Integrated solar power module
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United States of America Patent
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Oct 9, 2001
Grant Date -
N/A
app pub date -
Aug 28, 2000
filing date -
Aug 28, 2000
priority date (Note) -
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Abstract
Multiple layers of a clear insulating material, such as clear polyimide, with horizontal metalization layers therebetween and with vertical feed through metal traces therethrough form a flexible three dimension circuit printed circuit board upon which semiconductor devices, such as thin film solar cell can be directly deposited for forming a flexible electronic module, and upon which electronic discrete component can be bonded and electrically connected. In one exemplar configuration, a flexible thin film solar cell power module has thin film solar cells deposited on one side and power converters bonded on the other for a solar array power system. The flexible printed circuit board is well suited for forming electronic systems about a curved surface such as a power sphere nanosatellite.
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