Method for determining the compensation value of the width of a wire by measuring the resistance of the wire
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United States of America Patent
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Sep 25, 2001
Grant Date -
N/A
app pub date -
Sep 13, 1999
filing date -
Sep 13, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method is disclosed for determining a side-etching distance to compensate for the width of a wire to be formed on a printed circuit board. The wire is formed on a test board by etching off the copper foil on the test board with a film having the pattern of the wire. The wire is measured to find its resistance. The side-etching distance is obtained based on the formula: W=[(.rho./t).times.L].times.(1/R).+-..sigma., where W is the width of the wire, .rho. is the resistance coefficient of the copper foil, t is the thickness of the copper foil, L is the length of the wire, and .sigma. is the side-etching distance.
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