Method for producing foil circuit boards
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United States of America Patent
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Sep 25, 2001
Grant Date -
N/A
app pub date -
Jun 12, 2000
filing date -
Mar 23, 1994
priority date (Note) -
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Abstract
A method for producing a foil circuit board including a plurality of flexible electrically non-conductive and flexible conductive layers, which are laminated together. The non-conductive layers are positioned between the conductive layers and two of the conductive layers are the outermost surface layers of the foil circuit board. The circuit board includes flexible areas and rigid areas, and the flexible areas are provided by etching the board to remove at least part of one of the outermost surface layers and an adjacent underlying non-conductive layer.
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