High temperature resistant thin-film system
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 18, 2001
Issued Date -
N/A
app pub date -
Oct 7, 1998
filing date -
Apr 12, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A thin-film microcircuit resistant to high temperatures comprises a substrate fabricated of high-purity, densely packed alumina ceramic with a fine grain size, and metallization deposited thereon. The high temperature resistance is further improved by applying a vacuum anneal to the metallization. The present invention allows a glass fusing process to bond adjacent substrate layers together in forming a multi-layer module. The multi-layer modules integrate infrared detector arrays to signal conditioning circuitry. The prior art thin-film microcircuits were susceptible to damage from the glass fusing process, where the melting point of the glass reached 600.degree. C.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully