Process for bonding workpieces
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United States of America Patent
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Sep 18, 2001
Grant Date -
N/A
app pub date -
Sep 30, 1999
filing date -
Oct 1, 1998
priority date (Note) -
Expired
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Abstract
The process of bonding a first workpiece to a second workpiece is disclosed comprising the steps of fabricating a sintered bonding pad formed from a matrix of randomly oriented metallic fibers. The bonding pad is interposed between the first and the second workpiece and the first and second workpieces are biased into engagement with the bonding pad. Heat is applied to the first workpiece to the second workpiece for transforming substantially all of the metallic fibers into a liquid for bonding the first workpiece to the second workpiece.
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