Composite sputtering cathode assembly and sputtering apparatus with such composite sputtering cathode assembly
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United States of America Patent
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Sep 18, 2001
Grant Date -
N/A
app pub date -
Oct 20, 1997
filing date -
Oct 21, 1996
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Abstract
A sputtering apparatus includes a vacuum housing, a substrate holder disposed in the vacuum housing for holding a substrate thereon, and a composite sputtering cathode assembly disposed in the vacuum housing. The composite sputtering cathode assembly has a plurality of targets and a plurality of shields each disposed between adjacent ones of the targets. The targets are disposed in confronting relation to the substrate held on the substrate holder. Those sputtering particles expelled from the targets which are directed obliquely to the substrate hit the shields and do not reach the substrate. Only those sputtering particles which are directed substantially perpendicularly to the substrate are applied to the substrate. The distribution of film thicknesses on the substrate is made uniform when the substrate and the targets rotate relatively to each other.
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