Method and system for manufacturing a molded body
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Sep 11, 2001
Issued Date -
N/A
app pub date -
Sep 29, 2000
filing date -
Oct 15, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and system for fabricating molded components which include a molded body and a plurality of electrically conductive leads protruding therefrom. These components are made by overlaying an anode lead frame having anode leads, on a cathode lead frame having cathode leads, and then depositing molding material on intersected anode and cathode leads. The molded components are manufactured in an assembly line process which includes a feeder to feed the anode and cathode lead frames and a molder to deposit the molding material. Preferably, these molded components are lamp tiles.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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INTERPLEX INDUSTRIES INC | 14-34 110 STREET SUITE 301 COLLEGE POINT NY 11356 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Radloff, Robert Peter | Corona, CA | 4 | 26 |
# of filed Patents : 4 Total Citations : 26 |
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Patent Citation Ranking
- 9 Citation Count
- H01L Class
- 2.50 % this patent is cited more than
- 24 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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