Method and component for forming an embedded resistor in a multi-layer printed circuit
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United States of America Patent
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-
Sep 4, 2001
Grant Date -
N/A
app pub date -
Aug 18, 2000
filing date -
Aug 18, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A component for use in forming a multi-layer printed circuit comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate, and at least one layer of copper is applied on the layer of flash metal. A discrete area of a resistive material is disposed on a second side of the film substrate.
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