Method and apparatus for removing bonded dental appliances
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Aug 28, 2001
Grant Date -
N/A
app pub date -
Mar 16, 2000
filing date -
Mar 16, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
An orthodontic onlay having a mesial and distal sections is debonded from multiple teeth by positioning a plier-type debonding apparatus having a first and a second lever arms pivotally connected for rotation relative to each other and having respectively a first and a second handle portions, a hook extending from said second jaw portion, and a bracing platform pivotally connected to said first jaw portion and facing the hook. The appliance is removed by engaging the hook at the adhesive line of the appliance and the tooth, placing the bracing platform against the occlusal bonded surface of the appliance, pivoting the debonding apparatus clockwise and counterclockwise.
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