Method for reducing hot sticking in molding processes
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United States of America Patent
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Aug 28, 2001
Grant Date -
N/A
app pub date -
Aug 3, 1999
filing date -
Aug 4, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The method of the present invention overcomes the hot-sticking problems between an inorganic non-metallic material (=insulator) to be molded and a forming die by maintaining an assembly comprising a forming die and the insulator in a polarized state during molding. Processes using said method lead to an improved surface quality of the molded insulator. A device for reducing said hot-sticking comprises a die (2) which acts as conductor, an electrode (3) which may act as support for the insulator (1) to be molded, means (5) for polarizing the assembly of said conductor, insulator and electrode which means (5) are connected by live electric wires (4) with said die and electrode.
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