Semiconductor device and process for producing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 21, 2001
Issued Date -
N/A
app pub date -
Apr 7, 2000
filing date -
Jan 31, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The thickness of a tape carrier package having a semiconductor chip is made uniform where bonding pads are concentrated on one side of the semiconductor chip. The tape carrier package is such that dummy pads 6b are arranged on one side opposite to the side on which bonding pads (effective pins) 6a are arranged in the semiconductor chip. Dummy leads 5 are formed on an insulating tape 4. The semiconductor chip is supported with inner lead portions 5a connected to the corresponding bonding pads 6a and the inner lead portions 5a of the dummy leads 5 connected to the corresponding dummy pads 6b.
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