Surface mountable LED package
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United States of America Patent
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Aug 14, 2001
Grant Date -
N/A
app pub date -
Nov 5, 1998
filing date -
Nov 5, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
An LED package includes a heat-sinking slug that is inserted into an insert-molded leadframe. The slug may include an optional reflector cup. Within this cup, the LED and a thermally conducting sub-mount may be attached. Wire bonds extend from the LEDs to metal leads. The metal leads are electrically and thermally isolated from the slug. An optical lens may be added by mounting a pre-molded thermoplastic lens and a soft encapsulant or by casting epoxy to cover the LED or by a cast epoxy lens over a soft encapsulant.
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