Foil for use in filing substrate recesses
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United States of America Patent
Stats
-
Aug 14, 2001
Issued Date -
N/A
app pub date -
Jun 23, 1999
filing date -
May 28, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
To fill a hole or trench structure in an article, such as a semiconductor wafer, a layer is formed on the article. The layer extends over the structure so as to seal the mouth thereof. The layer may be deposited by sputtering, etc, or the layer may be deposited as a pre-formed foil. Then, the wafer and layer are subject to elevated pressure and elevated temperature such as to cause material of the layer to flow into the structure.
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