Metal polishing composition

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United States of America Patent

PATENT NO 6274063
SERIAL NO

09231247

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Polishing slurries for use in polishing substrates having a nickel or nickel-containing surface, such as those used for magnetic media, are described. The slurries include, in addition to a chemical etchant such as aluminum nitrate and suspended abrasive particles, an oxidizer which converts nickel metal at the surface to nickel oxide, but does not solubilize the nickel oxide in the aqueous medium to any significant degree. Preferred oxidizers include hydrogen peroxide, ferric nitrate and potassium iodate.

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Patent Owner(s)

Patent OwnerAddress
HMT TECHNOLOGY CORPORATION1055 PAGE AVENUE FREMONT CA 94538

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Li, Jiangning Fremont, CA 1 81
Yang, Ming M San Jose, CA 6 367

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