Method for producing filled vias in electronic components
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United States of America Patent
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Aug 7, 2001
Issued Date -
N/A
app pub date -
Nov 2, 1998
filing date -
Nov 2, 1998
priority date (Note) -
Expired
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Abstract
The present invention relates to a process for producing filled vias which are made of two components, a first component which forms a bonding layer between the wall of the via and a second component which forms the core of the via. Preferably, the two components solidify from a melt which includes two immiscible liquids. The first liquid is capable of wetting the wall of the via and the second liquid. The resulting product is also disclosed. Preferably the first component comprises a copper oxide and the second component comprises a conductive metal such as silver or copper.
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