Glass substrate assembly, semiconductor device and method of heat-treating glass substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 31, 2001
Grant Date -
N/A
app pub date -
Apr 20, 1999
filing date -
Oct 12, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Improved method of heat-treating a glass substrate, especially where the substrate is thermally treated (such as formation of films, growth of films, and oxidation) around or above its strain point. If devices generating heat are formed on the substrate, it dissipates the heat well. An aluminum nitride film is formed on at least one surface of the substrate. This aluminum nitride film acts as a heat sink and prevents local concentration of heat produced by the devices such as TFTs formed on the glass substrate surface.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully