Method of producing integrated electrodes in plastic dies, plastic dies containing integrated electrodes and application of the same
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United States of America Patent
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Jul 31, 2001
Issued Date -
N/A
app pub date -
Jun 17, 1999
filing date -
Oct 4, 1995
priority date (Note) -
Expired
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Abstract
Patterned dies made of non-conductive resins may be equipped with integrated electrodes in different manners. It is proved to be difficult to produce high-quality electrodes especially in microstructured dies. A patterned plastic die arranged on a carrier plate is filled with a solution of a metal compound. This solution is irradiated through the carrier plate from the back side of the carrier plate using laser light, ultraviolet light or X-rays. The metal compound is transformed in the immediate vicinity of the base of the structure and a metal layer is deposited on the base of the structure forming the electrodes. The method is suitable for a base of the structure forming a coherent or a non-coherent area. Plastic dies containing integrated electrodes are used for electroless or electrophoretic deposition of materials and for electroplating, in all cases starting from the integrated electrodes, and for analytical methods.
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