Lead frame and semiconductor device using the lead frame and method of manufacturing the same
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United States of America Patent
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Jul 24, 2001
Grant Date -
N/A
app pub date -
Mar 18, 1997
filing date -
Mar 18, 1996
priority date (Note) -
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Abstract
There is provided a semiconductor chip mounting area for mounting a semiconductor chip, and the points of the inner leads are made to come closer to the semiconductor chip mounting area by arranging the points of the inner leads at equal intervals over the whole periphery of the semiconductor chip mounting area. The points of the inner leads are arranged along the whole periphery of the semiconductor chip mounting area, and the lead pitch at the points of the inner leads corresponding to a corner portion of the semiconductor chip mounting area is made wider than the lead pitch of the other inner lead points.
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