Multiple layer module structure for printed circuit board
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United States of America Patent
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-
Jul 24, 2001
Grant Date -
N/A
app pub date -
Mar 22, 1999
filing date -
Dec 31, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A printed circuit board having multiple layers, includes: a copper film for removing signal interference and noise and matching impedance, formed between pads of a lowermost layer which are connected to of an uppermost layer.
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