Methods for using a support backer board system for siding
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United States of America Patent
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Jul 24, 2001
Grant Date -
N/A
app pub date -
Mar 2, 1999
filing date -
Mar 2, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for using a support backer board system and siding. The support backer board system comprises at least a first layer. The first layer is made from a material selected from the group consisting of alkenyl aromatic polymers, polyolefins, polyethylene terephthalate, polyesters, and combinations thereof. The board system is thermoformed into a desired shape with the desired shape being generally contour to the selected siding. The siding is attached to the board system so as to provide support thereto. In one process, the siding may be vinyl.
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