Non-etched high power HTS circuits and method of construction thereof
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United States of America Patent
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Jul 17, 2001
Grant Date -
N/A
app pub date -
Mar 9, 1998
filing date -
Mar 11, 1997
priority date (Note) -
Expired
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Abstract
A high power superconductive circuit has a thin film of high temperature superconductive material on a substrate. The circuit is formed from wafers that are placed into corresponding grooves within the substrate and held in place by adhesive. The grooves can be blind grooves or they can be through holes and the wafers will have a corresponding size and shape. The wafers include a thin film of high temperature superconductive material and can form resonators or an input or output. A circuit constructed in this manner has a relatively high power handling capability compared to circuits created by etching.
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