Multi-layer printed wiring board having integrated broadside microwave coupled baluns
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United States of America Patent
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Jul 17, 2001
Grant Date -
N/A
app pub date -
Jun 14, 1996
filing date -
Jun 14, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A microwave broadside coupled balun integral in a multi-layer printed wiring board formed by broadside coupled conductors embedded in the multi-layer printed wiring board. The balun may be used to form components which are integrated into the multi-layer printed wiring board, such as a microwave mixer formed by two of said broadside coupled baluns embedded in a multi-layer printed wiring board and connected to a diode ring quad.
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