Lead frame with heat slug
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 17, 2001
Grant Date -
N/A
app pub date -
Feb 16, 1999
filing date -
Nov 27, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The addition of a heat slug to a lead frame establishes a heat conduction path from a silicon chip on the lead frame to the heat slug. Hence, when a semiconductor package that encloses the lead frame and the silicon chip is formed, heat produced by the silicon chip can still be channeled away through the radiating surface of the heat slug. Furthermore, the heat slug can be bent over to cover burrs outside the package.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully