Process for the electroless deposition of copper coatings on iron and iron alloy surfaces
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United States of America Patent
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Jul 17, 2001
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N/A
app pub date -
Nov 6, 1995
filing date -
Nov 11, 1994
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Abstract
Disclosed is a process for the electroless deposition of a copper coating on an iron or iron alloy surface wherein the workpiece surface is contacted with a solution which contains hydrogen ions, 5 to 30 g/l Cu as well as 0.2 to 5 g/l Mg and preferably copper and magnesium with a weight ratio of Cu:Mg of (35 to 5):1 for a treatment time of 3 sec to 15 min at a temperature of the solution of 20 to 65.degree. C.
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