Testing device and method for known good chip
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United States of America Patent
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Jul 10, 2001
Grant Date -
N/A
app pub date -
Oct 27, 1998
filing date -
Oct 27, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A testing means for holding chips to perform tests comprises of a plurality of inner leads for providing electrical connection for the chips with a plurality of conductive bumps. A metal layer is formed on surfaces of the plurality of inner leads for fixing the chips on the plurality of inner leads, wherein a melting point of the metal layer is below a melting point of the conductive bumps. Then, a adhesive material is pasted on a bottom surface of the plurality of inner leads for fixing the plurality of inner leads. A holding means is used to connect and hold the plurality of inner leads, and used for providing electrical connection for the plurality of inner leads.
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