Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging method
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United States of America Patent
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Jul 10, 2001
Grant Date -
N/A
app pub date -
Jun 7, 1999
filing date -
Jun 7, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A packaging method for integrated circuit device, which is fit to apply flip chip bonding technique to a leadframe-type chip carrier. The packaging method will not increase the difficulty in assembly of the integrated circuit chip with the leadframe and is able to ensure that the integrated circuit chip be assembled with the lead fingers of the leadframe without false soldering. Also, the packaging method can achieve less inductance of the transmission line and faster transmission speed. In addition, the cost required of the packaging method can be much lower than that for the organic or ceramic base board.
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