Electrostatic chucks
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United States of America Patent
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Jul 3, 2001
Issued Date -
N/A
app pub date -
Sep 10, 1998
filing date -
Jun 3, 1997
priority date (Note) -
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Abstract
An electrostatic chuck 12 for a plasma reactor apparatus 10 comprises a base metallic section 23, a pair of electrodes 24 set in bonding material 27 and electrically insulated from the base by a plate 29 and a thick dielectric layer 20 (e.g. 0.5 to 1.5 mm), which covers the electrodes 24 and bonding material 27 and forms the support surfaces for wafers 31.
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