Lens, semiconductor laser element, device for machining the lens and element, process for producing semiconductor laser element, optical element, and device and method for machining optical element
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United States of America Patent
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Jul 3, 2001
Grant Date -
N/A
app pub date -
Mar 8, 1999
filing date -
Mar 8, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
This invention relates to a lens machining device for machining a lens so that the optical characteristics of light outputted by a semiconductor laser element (10) will be adjusted to desired ones. The lens (12) to be machined is provided at one end of the element (10) and the optical characteristics of the lens (12) are measured with a wave front measuring instrument (16) through the use of the light transmitted through the lens (12). A machining laser beam is focused upon the surface of the lens (12) through a beam splitter (14). The surface of the lens (12) is machined with the laser beam while a position adjusting device (22) adjusts the relative positional relation between the surface of the lens (12) and a position where the laser beam is focused. An ultraviolet laser (18) and the position adjusting device (22) are controlled by a controlling arithmetic device (24). The controlling arithmetic device (24) calculates machining data that bring the optical characteristics of the light transmitted through the lens (12) closer to the desired ones by using the measurement data from the wave front measuring instrument (16). When the lens is machined in such a way, the light transmitted through the lens (12) may have such optical characteristics that the shape of the light beam is a true circle.
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