Method of liquid treatment of microstructures comprising bendable structural members

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United States of America Patent

PATENT NO 6251743
SERIAL NO

09071991

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Abstract

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Microstructures, including a plurality of spaced structural members which are bendable under an external force, undergo a treating method using a first treating liquid, to prevent permanent deformation, by removing the microstructure from the first treating liquid to an environment having a pressure less than atmospheric pressure; or moving the microstructure from the first treating liquid to a second treating liquid having a smaller surface tension than the first treating liquid, and then removing the microstructure from the second liquid; or drying the microstructure removed from the first treating liquid by exposing same to a liquid vapor having a smaller surface tension than the first treating liquid; or removing the microstructure from the first treating liquid to the atmosphere, and drying the microstructure using an energy beam of high intensity or an ultrasonic wave.

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Patent Owner(s)

Patent OwnerAddress
FUJITSU MICROELECTRONICS LIMITED2-10-23 SHIN-YOKOHAMA KOHOKU-KU YOKOHAMA-SHI 222-0033

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ikeda, Toshimi Kawasaki, JP 23 147
Inoue, Fumihiko Kawasaki, JP 36 238
Ishikawa, Junichi Kawasaki, JP 65 445
Katayama, Masaya Kawasaki, JP 27 206
Kuwamura, Masahiro Kasugai, JP 4 16
Nakano, Motoo Kawasaki, JP 28 521
Nomura, Hiroshi Kawasaki, JP 449 6816

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