Conductive particle arranging device and conductive particle transferring method using the same
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United States of America Patent
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Jun 19, 2001
Grant Date -
N/A
app pub date -
Jan 12, 2000
filing date -
Sep 14, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A device for arranging conductive particles in a preselected pattern for the connection of electric circuit boards or electric parts is disclosed. Particularly, a device capable of surely and efficiently transferring, e.g., solder bumps to the electrode pads of a semiconductor chip or the leads of a TAB (Tape Automated Bonding) tape and a conductive particle transferring method using the same are disclosed.
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