Gas distribution apparatus for semiconductor processing

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6245192
SERIAL NO

09343690

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A gas distribution system for uniformly or non-uniformly distributing gas across the surface of a semiconductor substrate. The gas distribution system includes a support plate and a showerhead which are secured together to define a gas distribution chamber therebetween. A baffle assembly including one or more baffle plates is located within the gas distribution chamber. The baffle arrangement includes a first gas supply supplying process gas to a central portion of the baffle chamber and a second gas supply supplying a second process gas to a peripheral region of the baffle chamber. Because the pressure of the gas is greater at locations closer to the outlets of the first and second gas supplies, the gas pressure at the backside of the showerhead can be made more uniform than in the case with a single gas supply. In one arrangement, the first and second gas supplies open into a plenum between a top baffle plate and a temperature controlled support member wherein the plenum is divided into the central and peripheral regions by an O-ring. In a second arrangement, the first gas supply opens into the central region above an upper baffle plate and the second gas supply opens into the periphery of a plenum between the upper baffle plate and a lower baffle plate.

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Patent Owner(s)

Patent OwnerAddress
LAM RESEARCH CORPORATION4650 CUSHING PARKWAY FREMONT CA 94538

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dhindsa, Rajinder San Jose, CA 259 11448
Hao, Fangli Cupertino, CA 28 1782
Lenz, Eric Pleasanton, CA 33 2023

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